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    Silicon wafer

    Silicon wafer

    Silicon wafer is the carrier of solar cell, which is divided into monocrystalline silicon wafer and polycrystalline silicon wafer. The quality of wafer determines the cell’s’ efficiency directly.JY uses the world's most advanced slicing equipment, advanced diamond wire cutting technology to produce wafers, and also equipped with advanced testing machine to monitor wafer’s parameters,including surface conditions, lifetime,resistivity,conductive type and cracks.Our mission is to ensure the wafers are of the best quality.

    Technical Parameters

    Mono wafers

    ProjectTechnical Parameters
    Side length156.75±0.25mm156.75±0.25mm
    diameter210±0.25mm210±0.25mm
    thickness200±20μm180+20μm
    oxygen concentration≤0.8*1018atoms/cm3
    carbon concentration≤5*1016atoms/cm3
    Conductive model / dopantP/Borom
    Verticality90°±0.3°
    Minority life> 3μs (bare measurement),> 15μs (after passivation)
    Resistivity1-3Ω·cm
    TTV≤30μm
    Growth methodCZ Straight Pull
    Total thickness difference≤30μm
    saw mark≤15μm
    Arc width deviation12±0.5mm

    Multi wafers in DW slicing

    ProjectTechnical Parameters
    Side length156.75±0.25mm157±0.25mm157.75±0.25mm
    diameter220.2±0.5mm220.5±1mm221.7±1mm
    thickness200±20μm
    oxygen concentration≤5*1017atoms/cm3
    carbon concentration≤7*1017atoms/cm3
    Conductive model / dopantP/Borom
    Verticality90°±0.25°
    Minority life≥1μs (naked measurement)
    Resistivity1-3Ω·cm
    TTV≤30μm
    Growth methodDSS
    Total thickness difference≤30μm
    saw mark≤15μm
    hypotenuse0.5-2mm


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